Component Processing Services

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SMT Lead Forming Equipment & Services Catalog

Fancort is the industry leader in component lead preparation services for the Semiconductor and Aerospace industries. We have over thirty-six years of experience in lead forming of a wide variety of packages, including large and small flatpacks and quadpacks, DIPs, fiberoptic headers and devices that require conversion from through-hole to SMT. We use our unique universal and dedicated tooling systems and complete process control to ensure accuracy and quick turnaround of your parts to JEDEC and/or mil-spec dimensions, with optional services such as leak testing and tinning if required.

• Fancort Industries is "ITAR registered, code M22953, as of 15-May-2008". Fancort is, also, listed with the US Government under Cage Code # 6L 152. Fancort is an approved NASA supplier of Forming Services and Tools.
• Lead forming to Mil-std-883E and NASA Std FP 51 3414 Rev. H Section 3
• Complete process control and documentation
• Standard footprint layouts available, or we will design your custom footprint
• All work done in a controlled ESD Safe environment
• DOD MIL-STD-1686C Compliant
• Turnaround can be as little as three days (typically 10 workings days)
• Inspection of incoming devices for lead skew or other deformity
• Inspection report and Certificate of Compliance

• Lead tinning to Mil and NASA std 8739.2 8199 "workmanship std. for SMT" and Mil 2003.7 and Mil specs "QQ-S-571F"
• Tinning is done on our automated LTS200 machine
• Our tinning is done in a 100% inert, Nitrogen environment
• Solder used is 63/37 Ultra pure standard
• Example of tinned 256 ACTEL FPGA
• "Flux", for Gold leaded parts, is used at Fancort's discretion. Fancort's standard is: No Flux, no clean flux or OA Flux per J004
• Flux is a cleaning process that is normally not needed for high reliability Gold parts. NOTE: Rosin based fluxes are available, and can be special ordered. Please let us know what mil specs you need and your fluxing criteria
• Per Mil Std 2000A and J Std. Mil Std 200A section 5.3.1.3 "For surface mounted parts, the gold shall be removed from at least 95% of the total gold plated surface and there shall be no gold on the to be soldered areas of the part."
• Fancort's solder pot testing complies with J Std 001 contamination limits. Table 3-1 on page 5. Section 3.9.3 on page 6 for gold removal. (Similar to mil std 2000)
• Fancort standard Mil-spec process is a double dip procedure to remove the gold first, then add the second coating
• The normal Lead Tinning height is about 1/2 way up the leg, giving full heel coverage for excellent soldering to the PC Board
  
  
• Applicable Specifications & Standards:
  • IPC/EIA J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies
  • http://www.dscc.dla.mi/
  • MIL-PRF-38535, General Specification for Integrated Circuits Manufacturing
  • MIL-PRF-38534, General Specification for Hybrid Microcircuits
  • MIL-PRF-19500, General Specification for Semiconductor Devices
    
    
• Expedited delivery available
• Adjustable matrix trays for return shipping of your devices, including trays for Pick and Place machinery, and new single tray for holding 1 QFP or FP
• Lead form and trim tooling available for purchase to reduce costs on long-running jobs
• Leak testing to Mil-std 883, Med + Mod 1014.12, conditions A&C fine and gross
• Contractual agreements

Request the Quality Control Manual (Word Doc) with ESD/EOS Operating Standard CD (Word Doc)
Standard SMT Layouts
Technical and Specification Sheets
Component Lead Preparation Services Datasheet
Photos of Product and Inspection Departments
Adjustable matrix trays to hold two- and four-sided SMT devices
SMT Lead Forming Equipment & Services Catalog