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Pulse Heat Bonding and Soldering
Process Information
ACF/ Heat Seal
( check all that apply )		 Solder Reflow
( check all that apply )
TAB
Chip
Flex
Heat Seal Connector
 To Glass LCD
Flat Panel Display
PCB
Ceramic
Other
 Flex or TAB
Connector
Device
Wire
Other
Flat Leads
 To PCB (FR4)
Flex or TAB
Ceramic
Other
Round Leads

Dimensions and Description
All dimension in mm

Lead Pitch :
X-axis Footprint, Bx :
Y-axis Footprint, By :
Connector Lead Thickness, Bz :
Substrate Thickness, Sz :
Flux/Solder /ACF :

Contact Name:
Email:
Company:
Street Address:
City, State, Zip:
Phone Number:
Fax Number:
Today's Date:

Note: If there are multiple bonding sites, please include additional dimension and
description information below.

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