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SMT LEAD FORMING EQUIPMENT & SERVICES



SMT Lead Preparation Services

For more information, contact:
Lee Boki
1-888-FANCORT ext. 222

Component Processing Services

SMT Lead Forming Equipment & Services Catalog

 

Fancort is the industry leader in component lead preparation services for the Semiconductor and Aerospace industries. We have over thirty-nine years of experience in lead forming of a wide variety of packages, including large and small flatpacks and quadpacks, DIPs, fiberoptic headers and devices that require conversion from through-hole to SMT. We use our unique universal and dedicated tooling systems and complete process control to ensure accuracy and quick turnaround of your parts to JEDEC and/or mil-spec dimensions, with optional services such as leak testing and tinning if required.

Form and Trim Features:
  • Fancort Industries is "ITAR registered, code M22953, as of 15-May-2008". Fancort is, also, listed with the US Government under Cage Code # 6L 152. Fancort is an approved NASA supplier of Forming Services and Tools.
  • Lead forming to Mil-std-883E and NASA Std FP 51 3414 Rev. H Section 3and IPC J-STD-001E-2010 / April 2010
  • Complete process control and documentation
  • Standard footprint layouts available, or we will design your custom footprint
  • All work is done in a controlled ESD Safe environment. Our facility meets all requirements for Class Zero applications (0-250 volts).
  • DOD MIL-STD-1686C Compliant
  • Turnaround can be as little as three days (typically 10 working days)
  • Inspection of incoming devices for lead skew or other deformity
  • Inspection report and Certificate of Compliance
Tinning and Gold Removal Features:
  • Lead tinning to NASA STD 8739.3 with Change #4, "workmanship STD for SMT" and Mil 2003.7
  • Fancort is NASA STD 8739.2 CERTIFIED for tinning Space grade flat packs and quad packs as of 21-September-2011.
  • Tinning is done on our automated LTS200 machine
  • Our tinning is done in a 100% inert, Nitrogen environment
  • Solder used is 63/37 Ultra pure standard
  • Fancort uses a non-flux process with an automated tinning machine, Nirtogen blanket and dual dynamic pot process
  • Example of tinned 256 ACTEL FPGA
  • "Flux", for Gold leaded parts, is used at Fancort's discretion. Fancort's standard is: No Flux, no clean flux or OA Flux per J004
  • Flux is a cleaning process that is normally not needed for high reliability Gold parts.
  • Per Mil Std 2000A and J Std. Mil Std 200A section 5.3.1.3 "For surface mounted parts, the gold shall be removed from at least 95% of the total gold plated surface and there shall be no gold on the to be soldered areas of the part."
  • Fancort's solder pot testing complies with J Std 001 contamination limits. Table 3-1 on page 5. Section 3.9.3 on page 6 for gold removal. (Similar to mil std 2000)
  • Fancort standard Mil-spec process is a double dip procedure to remove the gold first, then add the second coating
  • The normal Lead Tinning height is about 1/2 way up the leg, giving full heel coverage for excellent soldering to the PC Board
  • Solder alloys used for solder dip are in accordance with J-STD-006, or equivalent, and shall contain a minimum of 3% lead. Hot solder dip meets the tinning requirements of ANSI/IPC J-STD-001, Class 3, and tinned leads shall meet the solderability requirements of J-STD-002, Category 3.
  • Fine and Gross Leak Testing
    • Leak testing to Mil-std 883, Med + Mod 1014.12, conditions A&C fine and gross
    • Adjustable Shipping matrix trays to hold two and four-sided SMT devices; includes ESD packaging
  • Applicable Specifications & Standards:

Component Lead Preparation Services Datasheet

Photos of Product and Inspection Departments

Request the New ISO Quality Control Manual

SMT Lead Forming Equipment & Services Catalog


Standard SMT Layouts


Technical and Specification Sheets

"Dummy Parts for SetUp" Quads
"Dummy Parts for SetUp" FlatPack