Features:

• One soldering head can do point-to-point and line soldering
• Solid core solder tips with 0.5mm of plating retain heat from point-to-point
• Change tip in 30 seconds by removing the heater block assembly
• Standard 200W cross heater with built-in thermocouple, 300W optional
  
• Graduated angle setter with tooling pins to accurately reproduce solder feed position when changing programs
• Precisely feeds solder wire from 0.5 to 1.2mm diameter; optional 0.2mm
• Program robot path, speed and all soldering conditions on teach pendant, up to 63 soldering conditions
• Tip temperature range to 450ºC
• Alarms: out of solder, solder jamming, heater control
• Four desktop models with work area up to 510mm x 510mm x150mm
• For in-line automation three robotic options. Each system comes with a controller, teaching box and solder tiop cleaner.
• Individual components can be purchased for integration to your automation cell.
  

Link Options Page:

• Brush Cleaner(twin): Two wire brushes are rotated to remove carbide at the soldering tip automatically.
• Clean-Cut Solder Feeder: Prevents explosion of flux by making a lengthwise cut in the flux-cored wire solder at the time of solder feeding. Its patented special 2-blade syystem can provide a stable solder reverse operation and also prevent solder slipping.
• Double Heater: The heater provided in the nitrogen gas passing section heats up the nitrogen to increase the pre-heating effect of nitrogen gas thereby reducing tact time.
• Fume Extractor: This device extracts flux fumes by using high suction power.
• Light curtain or full enclosure
• Lock-On Mechanism: This device prevents shifting of the feed position of wire solder.
• N₂ Tip Cap: This N₂ tip cup is used to jet the nitrogen gas from the nitrogen generator around the periphery of the soldering tip.
• Needle Swing Mechanism: An option for easier programming in tight spots, safety option included. When a brush cleaner is used, this device facilitates cleaning by swinging the solder feed (needle) automatically.
• Nitrogen Gas Generator: For lead free applications. This compact device puts the soldering tip to a nitrogen atmosphere to improve the wetability and spreadability of solder.
• Residual Solder Sensor: When the remaining quantity of wire solder becomes small, this sensor detects it and notifies the solder replacement time.
• Solder Tip Position Correction Mechanism: This device automatically corrects a positional shift in times of tip wear and thermal expansion.
• Solder Wire Preheater: At a solder feed, this device reheats wire solder to prevent the explosion of flux and scattering of solder balls.
• Vision Position Correction Sensor: This device checks the soldering position by using a CCD camera and corrects the coordiantes of the program automatically. (Image unavailable)
• Robotic Optional Platforms
• Ultrasonic soldering for the unsolderable
• Optional 'S' Video System with color camera and 17" monitor
  
  
• FAB (Features, Advantages and Benefits) of a Japan UNIX Soldering System
  

Fancort robotic soldering solutions include two methods of non-contact soldering for applications where contact soldering is not suitable. These include laser soldering using a UNIX soldering system, and microflame soldering with Spirflame® technology. The laser system incorporates a 30W or 50W laser diode system with built-in CCD camera for extremely accurate soldering of small points of contact. Microflame soldering using Spirflame® technology produces a flame up to 3000ºC for applications requiring a large amount of heat, very fine points of contact, or very fast cycle time. Fancort can integrate soldering systems into a desktop robot, a SCARA robot, or a custom system. Contact us today to discuss your application.

Robotic Soldering with Contact or Non-Contact Systems